Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability and testing

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Material type: Text

TextPublication details: Singapore Chemical Industry Press ; John Wiley & Sons. 2011Description: xxii, 564 p.; 25 cmISBN:

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Holdings
Item type	Current library	Collection	Call number	Status	Date due	Barcode	Item holds
Reference Books	LRC, IIT Indore 3rd Floor - Reference Collection	Reference	621.381046 LIU (Browse shelf(Opens below))	Not For Loan		18820

Total holds: 0

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