TY  - BOOK
AU  - Liu, Sheng 
AU  -  Liu, Yong
TI  - Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability and testing
SN  - 9780470827802
U1  - 621.381046 
PY  - 2011///
CY  - Singapore
PB  - Chemical Industry Press ; John Wiley & Sons.
ER  -