Liu, Sheng  <br/><br/>
Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability and testing 

 - Singapore  Chemical Industry Press ; John Wiley & Sons.  2011 
 - xxii, 564 p.; 25 cm 
<br/><br/><label>ISBN: </label>9780470827802 
<br/><br/><label>Dewey Class. No.: </label>621.381046  / LIU